PEEK Resin, Unfilled Powder
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Unfilled virgin PEEK powder with a narrow molecular weight distribution, suitable for compression molding, extrusion, and plasma spraying.
Technical Specifications
| CAS No. | 29658-26-2 |
|---|---|
| Molecular formula | (C19H12O3)n |
| Molecular weight | Mw approx. 4.5 x 10^4 g/mol (GPC) |
| Purity / Grade | >= 99.0%, ash <= 0.5% |
| Packaging | 25 kg sealed drum under nitrogen |
Product Overview
PEEK is among the best-performing specialty engineering plastics, with a continuous service temperature of 260 degrees Celsius plus outstanding chemical, fatigue, and flame resistance (UL 94 V-0). In-house DFBP monomer production secures feedstock quality, giving consistent melt flow and mechanical properties batch after batch.
This unfilled powder grade targets compression-molded parts such as compressor valve plates, semiconductor wafer carriers, and seal rings, as well as protective plasma-sprayed coatings on metal surfaces. Melt-flow screening and chromatographic analysis reports are available on request.